Which of the following best describes Thermal paste?
Difficulty: Medium
About this MCQ
This Medium Computer Hardware MCQ checks one syllabus fact.
The question is: “Which of the following best describes Thermal paste?”
The accepted answer is B. A compound applied between a CPU and heat sink to improve heat transfer.. A compound applied between a CPU and heat sink to improve heat transfer is the person body or term that satisfies Which of the following best describes Thermal paste option B Option A A hardware component that processes and outputs audio signals from a computer does not match the stem it is a near-miss used to catch incomplete recall of A compound applied between a CPU and heat sink to improve heat transfer Option C A hardware device that provides emergency battery power to a computer during a power outage does not match the stem it is a near-miss used to catch incomplete recall of A compound applied between a CPU and heat sink to improve heat transfer Remaining alternatives.
- A. A hardware component that processes and outputs audio signals from a computer.
Why not A: “A hardware component that processes and outputs audio signals from a computer.” is not correct. The accepted answer is B. A compound applied between a CPU and heat sink to improve heat transfer.. A compound applied between a CPU and heat sink to improve heat transfer is the person body or term that satisfies Which of the following best describes Thermal paste option B Optio
- B. A compound applied between a CPU and heat sink to improve heat transfer. ✓
- C. A hardware device that provides emergency battery power to a computer during a power outage.
Why not C: “A hardware device that provides emergency battery power to a computer during a power outage.” is not correct. The accepted answer is B. A compound applied between a CPU and heat sink to improve heat transfer.. A compound applied between a CPU and heat sink to improve heat transfer is the person body or term that satisfies Which of the following best describes Thermal paste option B Optio
- D. A hardware component that allows a computer to connect to a network.
Why not D: “A hardware component that allows a computer to connect to a network.” is not correct. The accepted answer is B. A compound applied between a CPU and heat sink to improve heat transfer.. A compound applied between a CPU and heat sink to improve heat transfer is the person body or term that satisfies Which of the following best describes Thermal paste option B Optio
Correct answer
B. A compound applied between a CPU and heat sink to improve heat transfer.
Explanation
A compound applied between a CPU and heat sink to improve heat transfer is the person body or term that satisfies Which of the following best describes Thermal paste option B Option A A hardware component that processes and outputs audio signals from a computer does not match the stem it is a near-miss used to catch incomplete recall of A compound applied between a CPU and heat sink to improve heat transfer Option C A hardware device that provides emergency battery power to a computer during a power outage does not match the stem it is a near-miss used to catch incomplete recall of A compound applied between a CPU and heat sink to improve heat transfer Remaining alternatives.
Source: Computer Hardware Official Reference Guide
Tags: computer science, hardware, computer components, PC hardware
Submitted by: MCQsHub Editorial
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