Which of the following best describes Thermal paste?
Difficulty: Medium
About this MCQ
This Medium Computer Hardware question asks: Which of the following best describes Thermal paste? The correct choice is B. A compound applied between a CPU and heat sink to improve heat transfer.. Read the options below, commit to one, then use the explanation to see why that choice holds and why the others do not.
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- A. A hardware component that processes and outputs audio signals from a computer.
Why not A: “A hardware component that processes and outputs audio signals from a computer.” does not fit this question. The answer is A compound applied between a CPU and heat sink to improve heat transfer..
- B. A compound applied between a CPU and heat sink to improve heat transfer. ✓
- C. A hardware device that provides emergency battery power to a computer during a power outage.
Why not C: “A hardware device that provides emergency battery power to a computer during a power outage.” does not fit this question. The answer is A compound applied between a CPU and heat sink to improve heat transfer..
- D. A hardware component that allows a computer to connect to a network.
Why not D: “A hardware component that allows a computer to connect to a network.” does not fit this question. The answer is A compound applied between a CPU and heat sink to improve heat transfer..
Correct answer
B. A compound applied between a CPU and heat sink to improve heat transfer.
Explanation
A compound applied between a CPU and heat sink to improve heat transfer. is the term that matches “Which of the following best describes Thermal paste” (option B). Option A (A hardware component that processes and outputs audio signals from a computer.) does not fit this question. Option C (A hardware device that provides emergency battery power to a computer during a power outage.) does not fit this question. Option D (A hardware component that allows a computer to connect to a network.) does not fit this question. For this Computer Hardware question, the accepted answer is A compound applied between a CPU and heat sink to improve heat transfer..
Source: Computer Hardware Official Reference Guide
Tags: computer science, hardware, computer components, PC hardware
Submitted by: MCQsHub Editorial
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