What is the name for a compound applied between a CPU and heat sink to improve heat transfer?
Difficulty: Medium
About this MCQ
This Medium Computer Hardware question asks: What is the name for a compound applied between a CPU and heat sink to improve heat transfer? The correct choice is B. Thermal paste. Read the options below, commit to one, then use the explanation to see why that choice holds and why the others do not.
Computer Hardware items like this one are written for Pakistan exams such as CSS, FPSC, PPSC, and NTS. The difficulty label is a hint about how much of the topic the stem assumes, not a score. Tags and exam names, when they are present, tell you where else the same idea is tested. Previous and next links stay in Computer Hardware so you can continue the subject. Related questions point at nearby stems if you want another angle on the same idea.
Treat the explanation as part of the question, not a footnote. If you missed it, reread the stem against the correct option before you open the next Computer Hardware item. A timed quiz is the same pool with a clock and a score. A past paper is a full sitting rather than this single question.
- A. Cooling fan
Why not A: “Cooling fan” does not fit this question. The answer is Thermal paste.
- B. Thermal paste ✓
- C. M.2 form factor
Why not C: “M.2 form factor” does not fit this question. The answer is Thermal paste.
- D. Graphics card
Why not D: “Graphics card” does not fit this question. The answer is Thermal paste.
Correct answer
B. Thermal paste
Explanation
Thermal paste is the value that answers “What is the name for a compound applied between a CPU and heat sink to improve heat transfer” (option B). Option A (Cooling fan) does not fit this question. Option C (M.2 form factor) does not fit this question. Option D (Graphics card) does not fit this question. For this Computer Hardware question, the accepted answer is Thermal paste.
Source: Computer Hardware Official Reference Guide
Tags: computer science, hardware, computer components, PC hardware
Submitted by: MCQsHub Editorial
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