What is the name for a compound applied between a CPU and heat sink to improve heat transfer?
Difficulty: Medium
About this MCQ
This Medium Computer Hardware MCQ checks one syllabus fact.
The question is: “What is the name for a compound applied between a CPU and heat sink to improve heat transfer?”
The accepted answer is B. Thermal paste. Thermal paste is the fact required by “What is the name for a compound applied between a CPU and heat sink to improve heat transfer” (option B). Option A (“Cooling fan”) does not match the stem; it is a near-miss used to catch incomplete recall of Thermal paste. Option C (“M.2 form factor”) does not match the stem; it is a near-miss used to catch incomplete recall of Thermal paste. Remaining alternatives (Graphics card) fall outside the same rule and should be eliminated once Thermal paste is identified. Computer Hardware questions of this type reward precise definitions rather than approximate associations. Computer Hardware recall of this distinction is a regular item in FPSC, PPSC, NTS, and CSS papers.
- A. Cooling fan
Why not A: “Cooling fan” is not correct. The accepted answer is B. Thermal paste. Thermal paste is the fact required by “What is the name for a compound applied between a CPU and heat sink to improve heat transfer” (option B). Option A (“Cooling fan”) does not m
- B. Thermal paste ✓
- C. M.2 form factor
Why not C: “M.2 form factor” is not correct. The accepted answer is B. Thermal paste. Thermal paste is the fact required by “What is the name for a compound applied between a CPU and heat sink to improve heat transfer” (option B). Option A (“Cooling fan”) does not m
- D. Graphics card
Why not D: “Graphics card” is not correct. The accepted answer is B. Thermal paste. Thermal paste is the fact required by “What is the name for a compound applied between a CPU and heat sink to improve heat transfer” (option B). Option A (“Cooling fan”) does not m
Correct answer
B. Thermal paste
Explanation
Thermal paste is the fact required by “What is the name for a compound applied between a CPU and heat sink to improve heat transfer” (option B). Option A (“Cooling fan”) does not match the stem; it is a near-miss used to catch incomplete recall of Thermal paste. Option C (“M.2 form factor”) does not match the stem; it is a near-miss used to catch incomplete recall of Thermal paste. Remaining alternatives (Graphics card) fall outside the same rule and should be eliminated once Thermal paste is identified. Computer Hardware questions of this type reward precise definitions rather than approximate associations. Computer Hardware recall of this distinction is a regular item in FPSC, PPSC, NTS, and CSS papers.
Source: Computer Hardware Official Reference Guide
Tags: computer science, hardware, computer components, PC hardware
Submitted by: MCQsHub Editorial
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